Multilayer PCB Stackup Designer
Choose the layer count, finished board thickness, laminate and copper weight. The designer builds a manufacturable stack-up from the real cores and prepregs in our factory material library and shows every layer with its thickness and Dk.
How the stack-up is built
Real materials
Cores and prepregs come from the same material library our engineers use for production: S1000H (Tg150), S1000-2M (Tg180), SH260 (Tg250) and more, each with its real thickness, copper foil and Dk.
Pressed thickness
Each prepreg is counted after pressing: it fills 50 % of the inner copper it bonds, so its finished thickness is less than the sheet thickness. A pressed prepreg never drops below 50 µm.
Symmetric and balanced
Cores are placed on the standard positions with the same thickness, prepregs are mirrored top to bottom, and the build with the fewest prepreg sheets inside ±10 % of your thickness is chosen.
Example stack-ups
Calculated live from our current material library.
4-layer PCB stackup, 1.6 mm, S1000H
| Layer | Material | Thickness |
|---|---|---|
| L1 · Top | 1 oz (35 µm) copper | 35 µm |
| Prepreg L1-L2 | S1000HB 1 × 3313 | 91 µm |
| L2 · Inner 1 | 0.5 oz (18 µm) copper | 18 µm |
| Core L2-L3 | S1000H core 1.265 mm (H/H) | 1265 µm |
| L3 · Inner 2 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L3-L4 | S1000HB 1 × 3313 | 91 µm |
| L4 · Bottom | 1 oz (35 µm) copper | 35 µm |
| Total | incl. 2 × 20 µm solder mask | 1.593 mm |
6-layer PCB stackup, 1.6 mm, S1000H
| Layer | Material | Thickness |
|---|---|---|
| L1 · Top | 1 oz (35 µm) copper | 35 µm |
| Prepreg L1-L2 | S1000HB 1 × 2116 | 121 µm |
| L2 · Inner 1 | 0.5 oz (18 µm) copper | 18 µm |
| Core L2-L3 | S1000H core 0.5 mm (H/H) | 500 µm |
| L3 · Inner 2 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L3-L4 | S1000HB 1 × 7628 | 177 µm |
| L4 · Inner 3 | 0.5 oz (18 µm) copper | 18 µm |
| Core L4-L5 | S1000H core 0.5 mm (H/H) | 500 µm |
| L5 · Inner 4 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L5-L6 | S1000HB 1 × 2116 | 121 µm |
| L6 · Bottom | 1 oz (35 µm) copper | 35 µm |
| Total | incl. 2 × 20 µm solder mask | 1.601 mm |
8-layer PCB stackup, 1.6 mm, S1000-2M
| Layer | Material | Thickness |
|---|---|---|
| L1 · Top | 1 oz (35 µm) copper | 35 µm |
| Prepreg L1-L2 | S1000-2MB 1 × 7628 | 186 µm |
| L2 · Inner 1 | 0.5 oz (18 µm) copper | 18 µm |
| Core L2-L3 | S1000-2M core 0.3 mm (H/H) | 300 µm |
| L3 · Inner 2 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L3-L4 | S1000-2MB 1 × 1080 | 54 µm |
| L4 · Inner 3 | 0.5 oz (18 µm) copper | 18 µm |
| Core L4-L5 | S1000-2M core 0.3 mm (H/H) | 300 µm |
| L5 · Inner 4 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L5-L6 | S1000-2MB 1 × 1080 | 54 µm |
| L6 · Inner 5 | 0.5 oz (18 µm) copper | 18 µm |
| Core L6-L7 | S1000-2M core 0.3 mm (H/H) | 300 µm |
| L7 · Inner 6 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L7-L8 | S1000-2MB 1 × 7628 | 186 µm |
| L8 · Bottom | 1 oz (35 µm) copper | 35 µm |
| Total | incl. 2 × 20 µm solder mask | 1.598 mm |
12-layer PCB stackup, 2.0 mm, S1000-2M
| Layer | Material | Thickness |
|---|---|---|
| L1 · Top | 1 oz (35 µm) copper | 35 µm |
| Prepreg L1-L2 | S1000-2MB 1 × 2116 | 121 µm |
| L2 · Inner 1 | 0.5 oz (18 µm) copper | 18 µm |
| Core L2-L3 | S1000-2M core 0.25 mm (H/H) | 250 µm |
| L3 · Inner 2 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L3-L4 | S1000-2MB 1 × 1080 | 54 µm |
| L4 · Inner 3 | 0.5 oz (18 µm) copper | 18 µm |
| Core L4-L5 | S1000-2M core 0.25 mm (H/H) | 250 µm |
| L5 · Inner 4 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L5-L6 | S1000-2MB 1 × 1080 | 54 µm |
| L6 · Inner 5 | 0.5 oz (18 µm) copper | 18 µm |
| Core L6-L7 | S1000-2M core 0.25 mm (H/H) | 250 µm |
| L7 · Inner 6 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L7-L8 | S1000-2MB 1 × 1080 | 54 µm |
| L8 · Inner 7 | 0.5 oz (18 µm) copper | 18 µm |
| Core L8-L9 | S1000-2M core 0.25 mm (H/H) | 250 µm |
| L9 · Inner 8 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L9-L10 | S1000-2MB 1 × 1080 | 54 µm |
| L10 · Inner 9 | 0.5 oz (18 µm) copper | 18 µm |
| Core L10-L11 | S1000-2M core 0.25 mm (H/H) | 250 µm |
| L11 · Inner 10 | 0.5 oz (18 µm) copper | 18 µm |
| Prepreg L11-L12 | S1000-2MB 1 × 2116 | 121 µm |
| L12 · Bottom | 1 oz (35 µm) copper | 35 µm |
| Total | incl. 2 × 20 µm solder mask | 1.998 mm |
Frequently asked questions
What is a PCB stackup?
A PCB stackup is the order and thickness of the copper layers, cores and prepregs that are pressed together to make a multilayer board. It sets the finished board thickness and the dielectric thickness between layers, which controls impedance.
What is the difference between a core and a prepreg?
A core is a cured laminate with copper on both sides and a fixed thickness. A prepreg is a glass cloth with uncured resin (106, 1080, 2116, 7628…); it bonds the cores and the outer copper foil together during pressing and becomes thinner as its resin fills the copper pattern.
Which material should I choose?
S1000H (Tg150) suits most standard multilayer boards. Choose S1000-2M (Tg180) for lead-free assembly with many reflow cycles or thicker boards, and SH260 (Tg250) for high-temperature applications. For Rogers / hybrid RF stack-ups, upload your files and our engineers will propose a build.
How accurate is the calculated thickness?
The designer uses the pressed prepreg thickness and counts 20 µm of solder mask per side. Finished boards are held to ±10 % of the ordered thickness; our engineers confirm the final stack-up with your order.
Can I order a board with this stack-up?
Yes. Choose the same layer count, thickness and material when you upload your Gerber files for an instant quote. You can also check your design first in our Gerber 3D viewer.
Ready to build it? Upload your Gerber files, pick the layer count and thickness, and get a price in minutes.
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